Development Of Ternary Ni-Ag-P And Ni-Cu-P Using Electroless Coating On Copper Substrate

Current functional test of assembled device in semiconductor industry use thermal interface media but it occasionally caused cosmetic defects such as stain or scratch mark. A possible solution to eliminate the undesired defects is by improving the nickel-phosphorus (Ni-P) coating currently applied o...

書目詳細資料
主要作者:	Md Sani, Nur Ariffah
格式:	Thesis
語言:	英语
出版:	2015
主題:	T Technology (General) TA401-492 Materials of engineering and construction. Mechanics of materials
在線閱讀:	http://eprints.usm.my/46917/
Abstract	Abstract here

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