Yusop, N. K. (2017). Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रYusop, Nurul Khalidah. Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method. 2017.
एमएलए (9वां संस्करण) प्रशस्ति पत्रYusop, Nurul Khalidah. Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method. 2017.
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