Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method

The increased in input/output (I/O) density due to the demand of high performances in devices caused the routing density on printed circuit board increased. This caused the board size increases due to the increased of trace width and trace spacing. Apart from that, the consumers preferred a small...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Yusop, Nurul Khalidah
التنسيق:	أطروحة
اللغة:	الإنجليزية
منشور في:	2017
الموضوعات:	T Technology
الوصول للمادة أونلاين:	http://eprints.usm.my/47315/

مواد مشابهة

Electrophoretic Deposition and Characterization of Copper Selenide Thin Films
حسب: Abdul Razak, Mohd Fairul Sharin
منشور في: (2007)

Optimization strategies of ultrasonic-assisted digestion of printed circuit board prior to determination of copper and lead
حسب: Abubakar, Kasimu
منشور في: (2020)

Thermal evaporation of copper doped tin (II) sulfide absorber thin film for solar cell application
حسب: Bachiran, Bakhtiar Ridhwan
منشور في: (2017)

Pulse electrochemical deposition and photocorrosion of copper indium diselenide thin film
حسب: Ghamarian, Nima
منشور في: (2012)

Electrochemical Deposition and Characterization of Copper Indium Disulfide Semiconductor Thin Films
حسب: Teo, Sook Liang
منشور في: (2011)

Bioleaching of copper from waste printed circuit board by potential bacteria isolated from a landfill
حسب: Razali, Muhammad Syafiq
منشور في: (2022)

Optimization of inkjet printing for copper indium gallium selenide solar absorber thin film
حسب: Yang, Ruisheng
منشور في: (2018)

Synthesis and characterization of nickel zinc ferrite thin films deposited using spin coating technique
حسب: Yusuf, Yusnita
منشور في: (2016)

Thermal model for electronic components placement on printed circuit board
حسب: Mohd. Abd. Mahi, Anwar
منشور في: (2013)

Selective metal recovery from printed circuit board wastewater
حسب: Md Ali, Abd Halim
منشور في: (2013)

Printed circuit board inspection using wavelet-based technique
حسب: Ibrahim, Zuwairie
منشور في: (2002)

Performance Evaluation Of An Agitated Thin Film Evaporator For Pineapple Juice Concentration
حسب: Emhamed, Ibrahim Greiby
منشور في: (2004)

Surface morphology and optical properties of copper nitride thin film synthesized by DC sputtering
حسب: Ma’Ajih, Nurul Shahida
منشور في: (2014)

Thin Film Silicon Solar Cell Prepared By Thermal Evaporation On Polyimide Substrate
حسب: Pakhuruddin, Mohd Zamir
منشور في: (2012)

Classification algorithms for six types of defects on bare printed circuit boards
حسب: Ibrahim, Ismail
منشور في: (2011)

Simulation model for analysis and design of printed circuit board production line
حسب: Wan Yussof, Wan Juwairiah
منشور في: (2007)

Development Of Lab On Printed Circuit Board Based Heavy Metal Detection
حسب: Beh, Khi Khim
منشور في: (2023)

Computer Vision Inspection And Classification On Printed Circuit Boards For Flux Defects
حسب: Ang, Teoh Ong
منشور في: (2016)

Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board
حسب: Safri, Syarnila
منشور في: (2020)

Electrodeposition of Nickel Tin Selenide Thin Film
حسب: Abd Rahim, Kartini
منشور في: (2003)

Time dependence of morphological and optical properties of DC sputtering grown copper oxide thin film
حسب: Sulaiman, Rosmaizatul Akma
منشور في: (2014)

Low Power Heater Design On Flexible Printed Circuit Board For Incubator Application
حسب: Hashim, Solehah Md
منشور في: (2018)

Morphology, structural and electrical properties of nickel-oxide-yttria-stabilized-zirconia thin film for solid oxide fuel cell electrode application
حسب: Md. Amin, Nor Hidayah
منشور في: (2019)

Structural and surface morphology of nanocystalline bismuth telluride thin films deposited using radio frequency magnetron sputtering
حسب: Albert Alim, Emilly
منشور في: (2014)

Analysis And Design Of Coplanar Waveguide For High-Speed Pulse Propagation On Printed Circuit Board
حسب: Abdullah, Mohd Muhaiyiddin
منشور في: (2007)

Modeling of dynamic behavior of printed circuit board (PCB) subjected to mechanical shock loading
حسب: Lau, Chin Wei
منشور في: (2006)

Impact Of Differential Pair Routing Discontinuities On Signal Integrity In Printed Circuit Board Design
حسب: Adanan, Omar Mukhtar
منشور في: (2013)

Tribology And Electrochemical Behavior Of Electroless Quaternary Nickel Alloy Deposition For Cutting Tools
حسب: Mohamad Noor, Mohamad Noor Azran
منشور في: (2019)

Nanoscale microstructural characterization of aluminum and copper bilayer thin films deposited on silicon substrate using magnetron sputtering technique
حسب: Abdul Halim, Zulhelmi Alif
منشور في: (2014)

Morphologies, optical and electrical characterization of aluminum tin sulfide thin film.
حسب: Hashim, Muhamad Faiz
منشور في: (2017)

Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
حسب: Lim, Chong Hooi
منشور في: (2017)

Composite material production of nonmetallic printed circuit board waste with recycled high density polyethylene
حسب: Muniyandi, Shantha Kumari
منشور في: (2015)

Potential reuse of recovered nonmetallic printed circuit board waste as sand replacement in construction materials
حسب: Mohamad, Siti Suhaila
منشور في: (2014)

Potentiostatic And Pulse Electrodepositon Of Copper Selenide Thin Films
حسب: Koo, Chee Siong
منشور في: (2009)

Electrical properties of copper nitride thin film prepared by reactive DC sputtering
حسب: Wan Mohd. Noral Azman, Wan Noor Ezianti
منشور في: (2013)

Growth And Characterization Of Nanostructured Nickel Oxide Thin Films For Photodetection Applications
حسب: Ahmed, Anas Awad Hasan
منشور في: (2020)

Investigation Of Irreversible Bonding Between Polydimethylsiloxane And Printed Circuit Board For Designing Leakage-Free Dna Biochip
حسب: Ali @ Hasim, Norshah Rizal
منشور في: (2017)

Preparation Of Tin Selenide Thin Film Semiconductor By Electrochemical Deposition And Electroselenisation
حسب: Ali, Ali Jimale
منشور في: (2000)

Deposition And Characterization Of Polyfluorene / Cerium Oxide Organic-Inorganic Thin Films
حسب: Ahmad, Farah Hayati Haji
منشور في: (2022)

Improvement of electronic components arrangement on printed circuit board based on thermal distribution profile using comsol multiphysics
حسب: Ab. Majid, Nurul Kausar
منشور في: (2018)