Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method

The increased in input/output (I/O) density due to the demand of high performances in devices caused the routing density on printed circuit board increased. This caused the board size increases due to the increased of trace width and trace spacing. Apart from that, the consumers preferred a small...

書誌詳細
第一著者:	Yusop, Nurul Khalidah
フォーマット:	学位論文
言語:	英語
出版事項:	2017
主題:	T Technology
オンライン･アクセス:	http://eprints.usm.my/47315/

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