Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape
The influence of substrate copper density distribution, substrate bump coplanarity, stiffener attach process, and substrate clamping by magnetic boat during die attach towards Flip Chip Ball Grid Array (FCBGA) assembled package warpage were evaluated. The substrate warpage behavior throughout the...
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2020
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/47543/ |