Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging
This thesis presents the thermal impact of thermal interface material 1 (TIM1) and heat spreader co-planarity to the flip chip package with heat spreader. The TIM1 material influences the efficiency of heat transfer from silicon die to the heat spreader while the co-planarity of heat spreader affect...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2020
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/47762/ |
| Abstract | Abstract here |