An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer

Diamond-Wire Sawn (DWS) technique in Photovoltaic (PV) wafer slicing has the capability to slice out thinner wafers at a faster speed and lower kerf lost. However, thinner wafers will cause higher breakage rate. In-line inspection of defects such as wafer’s edge chipping has become more important...

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