An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer

Diamond-Wire Sawn (DWS) technique in Photovoltaic (PV) wafer slicing has the capability to slice out thinner wafers at a faster speed and lower kerf lost. However, thinner wafers will cause higher breakage rate. In-line inspection of defects such as wafer’s edge chipping has become more important...

書誌詳細
第一著者:	Lim, Thai Li
フォーマット:	学位論文
言語:	英語
出版事項:	2019
主題:	T Technology TK Electrical Engineering. Electronics. Nuclear Engineering
オンライン･アクセス:	http://eprints.usm.my/50617/
Abstract	Abstract here

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