Effect Of Grain Refinement Process Using Equal Channel Angular Pressing On The Properties And Corrosion Behaviour Of Sn-3.0ag-0.5Cu Solder

Due to the inherent toxicity of Pb, environmental regulations have been enforced to eliminate the usage of Pb-based solders in electronic devices. Sn-Ag-Cu alloys is an attractive candidate due to good mechanical properties, good wettability and low melting temperature. However, the reliability of S...

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Détails bibliographiques
Auteur principal: Abu Bakar, Nur Adriana Nazifa
Format: Thèse
Langue:anglais
Publié: 2019
Sujets:
Accès en ligne:http://eprints.usm.my/56163/
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