Determination Of Fracture Toughness In PBGA Packages Using Finite Element And Experimental Methods

Electronic packages especially the plastic ball grid array (PBGA) has its unique crack failure arising from the soldering process. The existence of moisture absorbed in package from ambient condition causes vapor pressure. During reflow soldering processes (215°C), the moisture absorbed vaporizes...

書誌詳細
第一著者:	Tan, Chew Pheng
フォーマット:	学位論文
言語:	英語
出版事項:	2006
主題:	TA1-2040 Engineering (General). Civil engineering (General)
オンライン･アクセス:	http://eprints.usm.my/56293/
Abstract	Abstract here

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