Heat generation transport in micro and sub- micro scale in electronic packaging

Energy exchange takes place in extremely small dimension and time scale in the process of micro-electronic packaging. For fast heating response. Fourier conduction law is inadequate to explain the phenomena. Thus. compensate the Fourier law, named as Non-Fourier law. Non-Fourier law, based on tw...

書誌詳細
第一著者:	Ooi, Chun Keang
フォーマット:	学位論文
言語:	英語
出版事項:	2003
主題:	TJ1 Mechanical engineering and machinery
オンライン･アクセス:	http://eprints.usm.my/58319/
Abstract	Abstract here

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