Analysis Of Plastic Encapsulation Process In 3D IC Package With Through-Silicon Via (Tsv) Technology

Through-silicon via (TSV) technology has been an emerging technology to 3D heterogeneous system integration through vertical interconnection. This promising technology enables smaller footprints, reduced signal delay, shorter interconnections, lower power consumption and higher integration densit...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Ong, Ern Seang
التنسيق:	أطروحة
اللغة:	الإنجليزية
منشور في:	2013
الموضوعات:	TK1-9971 Electrical engineering. Electronics. Nuclear engineering
الوصول للمادة أونلاين:	http://eprints.usm.my/61078/
Abstract	Abstract here

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