Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
The thermal behaviour of an electronic package is often characterized by evaluating the junction temperature and thermal resistance at the junction of a single or multiple heat source to ambient. In the case of IC LED drivers, the heat source within the device is either single or multiple due to...
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| フォーマット: | 学位論文 |
| 言語: | 英語 |
| 出版事項: |
2018
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| 主題: | |
| オンライン･アクセス: | http://eprints.usm.my/61209/ |