Abdullah, M. K. (2006). Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रAbdullah, Muhammad Khalil. Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 F Rb]. 2006.
एमएलए (9वां संस्करण) प्रशस्ति पत्रAbdullah, Muhammad Khalil. Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 F Rb]. 2006.
चेतावनी: ये उद्धरण हमेशा 100% सटीक नहीं हो सकते हैं.