Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic asse...
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| Format: | Thesis |
| Language: | English |
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2007
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| Online Access: | http://eprints.usm.my/9486/ |
| Abstract | Abstract here |
| _version_ | 1855629234304712704 |
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| author | Mayappan, Ramani |
| author_facet | Mayappan, Ramani |
| author_sort | Mayappan, Ramani |
| description | Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah.
Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Due to the increase in the use of electronic devices within the industry as well as personal use, the usage of solder connections has increased.
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| first_indexed | 2025-10-17T07:54:03Z |
| format | Thesis |
| id | usm-9486 |
| institution | Universiti Sains Malaysia |
| language | English |
| last_indexed | 2025-10-17T07:54:03Z |
| publishDate | 2007 |
| record_format | EPrints |
| record_pdf | Restricted |
| spelling | usm-94862017-05-15T08:05:07Z http://eprints.usm.my/9486/ Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. Mayappan, Ramani TK7800-8360 Electronics Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Due to the increase in the use of electronic devices within the industry as well as personal use, the usage of solder connections has increased. 2007-09 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/9486/1/STUDY_ON_THE_WETTING_PROPERTIES%2C_INTERFACIAL_REACTIONS_AND_MECHANICAL_PROPERTIES_OF_Sn-Zn_AND_Sn-Zn-Bi_SOLDERS_ON_COPPER_METALLIZATION.pdf Mayappan, Ramani (2007) Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. PhD thesis, Universiti Sains Malaysia. |
| spellingShingle | TK7800-8360 Electronics Mayappan, Ramani Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. |
| thesis_level | PhD |
| title | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. |
| title_full | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. |
| title_fullStr | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. |
| title_full_unstemmed | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. |
| title_short | Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb]. |
| title_sort | study on the wetting properties interfacial reactions and mechanical properties of sn zn and sn zn bi solders on copper metallization tk7870 r165 2007 f rb |
| topic | TK7800-8360 Electronics |
| url | http://eprints.usm.my/9486/ |
| work_keys_str_mv | AT mayappanramani studyonthewettingpropertiesinterfacialreactionsandmechanicalpropertiesofsnznandsnznbisoldersoncoppermetallizationtk7870r1652007frb |