Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].

Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah. Practically all microelectronic asse...

書誌詳細
第一著者:	Mayappan, Ramani
フォーマット:	学位論文
言語:	英語
出版事項:	2007
主題:	TK7800-8360 Electronics
オンライン･アクセス:	http://eprints.usm.my/9486/
Abstract	Abstract here

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