Effect of in SITU DC and PDC substrate bias cleaning process on TiN coating adhesion in PVD system

• المؤلف الرئيسي: Hanizam , Hashim
• التنسيق: أطروحة
• اللغة: الإنجليزية
• منشور في: 2013
• الموضوعات: TJ Mechanical engineering and machinery
• الوصول للمادة أونلاين: http://eprints.utem.edu.my/id/eprint/15744/; http://library.utem.edu.my:8000/elmu/index.jsp?module=webopac-d&action=fullDisplayRetriever.jsp&szMaterialNo=0000085767

This research compared the effect ofPDC and DC substrate biases applications at -500V and study the effect of PDC voltage variations (OV, -200V, -500V, -800V) during substrate cleaning on coating adhesion. The substrate and coating materials used were tungsten carbide(WC) and titanium nitride (TiN), respectively. Aside from adhesion, data on surface roughness,surface energy, crystallite size and crystal orientation were also collected to further explain theexperimental results. Statistical analyses such T-Test, ANOV A, and Regressions Analysis were conducted on the collected data using Mini tab and EXCEL software. The results of this research indicated that coating adhesion on specimen using PDC as substrate bias exhibited significantly higher coating adhesion (7%) compared to that of the DC substrate specimen. In addition,substrate's surface roughness reduced by 38o/o, crystallite size reduced by 10% and surface energy increased by 5.7o/o that lead to the adhesion improvement trend from DC to PDC. The study also indicated that as PDC voltage increased, coating adhesion also increased linearly and the coefficient of determination R2 value of 0.961 between the two indicates a strong correlation. The results of PDC substrate bias also indicated linear correlations between surface roughness and surface energy to coating adhesion with R2 values of 0.982 and 0.903,respectively.