The micro-structural characterization of thermosonic cu-al intermetallic compounds and modelling of its interface stress

Thermosonic bonding of the Cu wire on Al bond pad is a common technology used in semiconductor industry. However, recent research show voids formation at this bonding interface on micro-chip, after an annealing treatment of High Temperature Storage (HTS). This voids formation is believed due to the...

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Bibliographic Details
Main Author:	Chua, Kok Yau
Format:	Thesis
Language:	English English
Published:	2015
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/16883/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=96181
Abstract	Abstract here

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