Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding

Low cost, high reliable and robust semiconductor packages are required in order for semiconductor manufacturer to stay competitive in the industry. This requires a stable manufacturing process that able to maintain high production yield, reduce customer reject and scrap cost. Currently, combination...

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Bibliographic Details
Main Author:	Tey, Sock Chien
Format:	Thesis
Language:	English English
Published:	2016
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/18372/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=100166
Abstract	Abstract here

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