Molding temperature control enhancement for transfer molding process via additional wire heater

• المؤلف الرئيسي: Zainal, Mohd Syafiq
• التنسيق: أطروحة
• اللغة: الإنجليزية; الإنجليزية
• منشور في: 2016
• الموضوعات: T Technology (General); TJ Mechanical engineering and machinery
• الوصول للمادة أونلاين: http://eprints.utem.edu.my/id/eprint/20455/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104964

In transfer molding process, molding temperature is the most vital parameter that needs to be control as tight as possible so that the optimum molding temperature is attained during transfer molding. Each type of mold compound requires different optimum molding temperature depending on their requirement. However to control the molding temperature is not an easy task as during molding process mold chase temperature cycle kept continuously fluctuating due to heat loss by surrounding throughout molding process. Thus a good mold chase temperature controller is a big advantage in order to obtain a quality molded product. However the Low Stress Mold Compound (LSMC) type mold compound has a very small temperature operating window by referring from the viscosity curve versus molding temperature. The optimum mold temperature for this mold compound is at 190± 3°C.Current molding machine mold chase temperature control capability is at ±5°C,therefore a new innovation method is needed on current molding machine to overcome this issue by introducing the additional wire heater near to the mold cavity surface to have better control of the mold chase temperature. With this innovation, the mold chase temperature is controlled at ± l.5°C which complies with the operating window of LSMC mold compound .By doing this, losses due to the temperature instability during molding process are reduced significantly.