APA (7th ed.) Citation

Chan, S. G. (2016). Development on copper to copper bonding optimization on low-k structure integrated circuit device.

Chicago Style (17th ed.) Citation

Chan, Swee Guan. Development on Copper to Copper Bonding Optimization on Low-k Structure Integrated Circuit Device. 2016.

MLA (9th ed.) Citation

Chan, Swee Guan. Development on Copper to Copper Bonding Optimization on Low-k Structure Integrated Circuit Device. 2016.

Warning: These citations may not always be 100% accurate.