APA (7th ed.) Citation

Lim, K. T. (2016). Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique.

Chicago Style (17th ed.) Citation

Lim, Kean Teik. Solder Paste Printing Yield Improvement for SMT Ultra Fine Pitch Product by Using Six Sigma Technique. 2016.

MLA (9th ed.) Citation

Lim, Kean Teik. Solder Paste Printing Yield Improvement for SMT Ultra Fine Pitch Product by Using Six Sigma Technique. 2016.

Warning: These citations may not always be 100% accurate.