Tan, K. H. (2016). Non-sticking on ground ring improvement for copper wire bonding with DMAIC approach.
Chicago Style (17th ed.) CitationTan, Kian Heong. Non-sticking on Ground Ring Improvement for Copper Wire Bonding with DMAIC Approach. 2016.
MLA (9th ed.) CitationTan, Kian Heong. Non-sticking on Ground Ring Improvement for Copper Wire Bonding with DMAIC Approach. 2016.
Warning: These citations may not always be 100% accurate.