APA (7th ed.) Citation

Heng, S. A. (2016). Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS.

Chicago Style (17th ed.) Citation

Heng, Soo Ann. Improvement of Molding Process Scheduled Downtime Reduction for Integrated Circuits Package DPAK STS. 2016.

MLA (9th ed.) Citation

Heng, Soo Ann. Improvement of Molding Process Scheduled Downtime Reduction for Integrated Circuits Package DPAK STS. 2016.

Warning: These citations may not always be 100% accurate.