Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS

• Main Author: Heng, Soo Ann
• Format: Thesis
• Language: English; English
• Published: 2016
• Subjects: T Technology (General); TP Chemical technology
• Online Access: http://eprints.utem.edu.my/id/eprint/20941/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104922

This master project proposed is to look insight into semiconductor field related project which has the topic of IMPROVEMENT OF MOLDING PROCESS SCHEDULED DOWNTIME FOR INTEGRATED CIRCUITS PACKAGE DPAK STS where common name of Dpak will be power product T0252 series. First and foremost, the topic involved in this project will be the introduction which includes problem statement that contributes to the start of project where the need of reducing schedule downtime in molding process is included. It is then followed by literature review where work of others are reviewed so that the no repetition on work done is available and to study on the method of implementation done by others in the similar field. This project will also discuss about the method used in the detail analysis in the project so that waste on downtime can be achieved. Upon result of analysis is available, various improvement actions will be suggested accordingly. By implementation of the improvement actions in the production, the result of the implementation will be monitored according to the implementation date. The objective of performing improvement in schedule downtime reduction for Molding process of integrated circuits package DPAK STS in Infineon Technologies (M) Sdn Bhd will be monitored in the result & discussion section.