Effect of epoxy nozzle separation on die attach adhesion at chip / substrate interface

Semiconductor products utilized in the automotive application need to be in high quality and more robust to ensure safe driving for the user. Thus, the semiconductor product manufacturers are moving toward zero defects target to gain the upper hand of the automotive market. One of the targets is to...

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Bibliographic Details
Main Author:	Yeo, Kian Hong
Format:	Thesis
Language:	English English
Published:	2016
Subjects:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utem.edu.my/id/eprint/21028/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104946
Abstract	Abstract here

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