APA引文

Mohd Tahir, M. H. H. (2016). Improvement of mold ability and wire sweep in semiconductor devices using DOE statistical approach.

芝加哥风格引文

Mohd Tahir, Mohd Hirzarul Hafiz. Improvement of Mold Ability and Wire Sweep in Semiconductor Devices Using DOE Statistical Approach. 2016.

MLA引文

Mohd Tahir, Mohd Hirzarul Hafiz. Improvement of Mold Ability and Wire Sweep in Semiconductor Devices Using DOE Statistical Approach. 2016.

警告:这些引文格式不一定是100%准确.