APA (7th ed.) Citation

Lim, M. S. (2017). Mold filling parameters in resin transfer molding for flip chip semiconductor packages.

Chicago Style (17th ed.) Citation

Lim, Ming Siong. Mold Filling Parameters in Resin Transfer Molding for Flip Chip Semiconductor Packages. 2017.

MLA (9th ed.) Citation

Lim, Ming Siong. Mold Filling Parameters in Resin Transfer Molding for Flip Chip Semiconductor Packages. 2017.

Warning: These citations may not always be 100% accurate.