Mold filling parameters in resin transfer molding for flip chip semiconductor packages

Flip chip technology is always been the preferred option for semiconductor packaging technology due to its advantages in both material and manufacturing cost compare co wire bonding interconnect technology. Inversely, flip chip technology with chip flipped and attached to substrate provides a gap in...

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Bibliographic Details
Main Author:	Lim, Ming Siong
Format:	Thesis
Language:	English English
Published:	2017
Subjects:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utem.edu.my/id/eprint/22475/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109156
Abstract	Abstract here

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