APA (7th ed.) Citation

Abd Rahman, R. (2017). Improvement of change glue schedule down time at lid attachment process for semiconductor devices. UTeM.

Chicago Style (17th ed.) Citation

Abd Rahman, Rozeana. Improvement of Change Glue Schedule Down Time at Lid Attachment Process for Semiconductor Devices. UTeM, 2017.

MLA (9th ed.) Citation

Abd Rahman, Rozeana. Improvement of Change Glue Schedule Down Time at Lid Attachment Process for Semiconductor Devices. UTeM, 2017.

Warning: These citations may not always be 100% accurate.