Improvement of change glue schedule down time at lid attachment process for semiconductor devices

This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process...

書目詳細資料
主要作者:	Abd Rahman, Rozeana
格式:	Thesis
語言:	英语英语
出版:	UTeM 2017
主題:	T Technology (General) TS Manufactures
在線閱讀:	http://eprints.utem.edu.my/id/eprint/23785/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109159 TJ211.42.L64 2017
Abstract	Abstract here

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