Improvement of change glue schedule down time at lid attachment process for semiconductor devices

This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process...

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Bibliographic Details
Main Author:	Abd Rahman, Rozeana
Format:	Thesis
Language:	English English
Published:	UTeM 2017
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/23785/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109159 TJ211.42.L64 2017
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