Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress

Quality requirement in the semiconductor industry is getting more stringent due to the application of semiconductor components that are widely used in automotive. Furthermore different materials combination is being introduced to semiconductor packages to improve their package performance and reduce...

وصف كامل

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Lee, Cher Chia
التنسيق:	أطروحة
اللغة:	الإنجليزية الإنجليزية
منشور في:	UTeM 2017
الموضوعات:	T Technology (General) TS Manufactures
الوصول للمادة أونلاين:	http://eprints.utem.edu.my/id/eprint/23786/ http://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109161 TJ211.42.L64 2017
Abstract	Abstract here

مواد مشابهة

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