APA (7th ed.) Citation

Ganasan, U. (2018). Elimination of gold tarnish by post dip after gold plating process in flexible printed circuit board manufacturing.

Chicago Style (17th ed.) Citation

Ganasan, Umadewi. Elimination of Gold Tarnish by Post Dip After Gold Plating Process in Flexible Printed Circuit Board Manufacturing. 2018.

MLA (9th ed.) Citation

Ganasan, Umadewi. Elimination of Gold Tarnish by Post Dip After Gold Plating Process in Flexible Printed Circuit Board Manufacturing. 2018.

Warning: These citations may not always be 100% accurate.