Ganasan, U. (2018). Elimination of gold tarnish by post dip after gold plating process in flexible printed circuit board manufacturing.
शिकागो शैली (17वां संस्करण) प्रशस्ति पत्रGanasan, Umadewi. Elimination of Gold Tarnish by Post Dip After Gold Plating Process in Flexible Printed Circuit Board Manufacturing. 2018.
एमएलए (9वां संस्करण) प्रशस्ति पत्रGanasan, Umadewi. Elimination of Gold Tarnish by Post Dip After Gold Plating Process in Flexible Printed Circuit Board Manufacturing. 2018.
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