Elimination of gold tarnish by post dip after gold plating process in flexible printed circuit board manufacturing

Flexible printed circuits (FPC) industry has high growth rate and high competition. FPC manufacturer should always ensure tighter tolerance to produce the highest quality of output products to their important and fulfill customer's high quality demand. Gold plating is often used in the electron...

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Bibliographic Details
Main Author:	Ganasan, Umadewi
Format:	Thesis
Language:	English English
Published:	2018
Subjects:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://eprints.utem.edu.my/id/eprint/23959/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=114813
Abstract	Abstract here

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