Badaruddin, N. I. (2018). Optimization of secondary bonding in layup process based on six sigma method.
Chicago Style (17th ed.) CitationBadaruddin, Nur Izayu. Optimization of Secondary Bonding in Layup Process Based on Six Sigma Method. 2018.
MLA (9th ed.) CitationBadaruddin, Nur Izayu. Optimization of Secondary Bonding in Layup Process Based on Six Sigma Method. 2018.
Warning: These citations may not always be 100% accurate.
