Implementation of overall equipment effectiveness in surface mounting technology

• Main Author: V. Nanjan, Davandran
• Format: Thesis
• Language: English; English
• Published: 2019
• Subjects: T Technology (General); TS Manufactures
• Online Access: http://eprints.utem.edu.my/id/eprint/25164/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=117853

The purpose of this paper is to study on implementing Overall Equipment Effectiveness (OEE) in Surface Mounting Technology (SMT) for Flexible Circuit Board Assembly Industry. OEE comprises of Availability, Performance and Quality which able to identify six major losses in the manufacturing which consist of machine breakdown, set up and adjustment, minor stoppages, reduce speed, starl-up rejection and production reject However, this study focused on reduced speed loss whereas printing speed is not as accordance mentioned in solder paste technical data sheet, The solder paste and machine capable to print with 100mm/s but actual setting is slower which was a loss that was identified. Therefore, printing speed been standardised and the consequence from it being analysed and improved. Prior to this, the weaknesses identified on Availability, Performance and Quality which decreasts the OEE ratio. Hence, PDCA methodology being adapted in this study as a proper plan to identify the root causes and implementation of improvement action to enhance OEE ratio. The PDCA implementation have been supported by tools such as brainstorming, Ishikawa diagram, Five Why’s technique and Kaizen. As consequence, two improvement activities introduced which are pallet cooling system and laser cut stainless steel stencil with Nano-coating. Pallet coolingsystem implemented to overcome the machine idling due to waiting pallet to cool down. Hence, this implementation reduced pallet cooling time from the current stage of approximately 300 seconds to below 120 seconds. The next improvement action was laser cut stencil with Nano-coating implemented to improve paste transfer efficiency. Hence, paste volume was measured and data shows stencil with coating achieved better volume on the soldering pad which was 153.86% compare to stencil without coating which are at 108.24%. Thercfore, it improved the quality yield by reducing open joint solder short defeets. The result of this study shows by adapting these tools, Availability achieved target set of 85% while Performance improved to consistently above 70% and Quality ratio above 98%. As a result, OEE shows improvement which consistently achieved above 60%.