The Study Of Temperature Analysis On Fusible Metal Bonding Application

High frequency packages become very important due to the rapid growth of wireless communication system. They require compactness, low cost and high performances ever at frequency up to 60 GHz. Flip-chip device assembly using organic substrates at very high frequency has become a cost competitive pac...

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Bibliographic Details
Main Author:	Gnanasegaran, Yogeswaran
Format:	Thesis
Language:	English English
Published:	2020
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/25496/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119739
Abstract	Abstract here

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