Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board

• Main Author: Safri, Syarnila
• Format: Thesis
• Language: English; English
• Published: 2020
• Subjects: T Technology (General); TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.utem.edu.my/id/eprint/25546/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119196

Nowadays, flexible printed circuit board also well known as flexible circuit is considered as the most efficient design block in electronic system operation. In basic construction of flexible circuit, there are additional material stiffener require to added for giving mechanical support on components and connectors due to its dynamic and flexible structure. There are various types of stiffener applied in manufacturing of flexible circuit. Metal stiffener is one of the common material chosen in thickening the flex thickness and eventually provide functionality base ground to the electric and electronic device system. However, due to some distortion, metal stiffener lifted issue is repeatedly occur and escapee to customer end user. Therefore, this study are being carried out to analyze and eliminate the metal stiffener lifted issue during manufacturing of flexible printed circuit board through several trial and eror experimental investigation. This study investigated the suitable types of metal stiffener adhesive material together with types of pressing machine process in applying the metal stiffener on surface of flexible circuit. Generally, all potential root cause have been solved by using Ishikawa diagram through the five factors such as man's, methodology, environment control, machine and material. However, further study are require to select the suitable types of metal stiffener adhesive material and types of pressing machine to ensure the sustainability. Moreover, this experimental investigation performance are able to be measured by using three types of quality inspection which are visual inspection, peel strength test, and temperature-humidity test. Hence, as a summary of this study, non conductive pyralux dupont LF without adhesive material and with using lamination pressing machine model LFD-200 is determine and validate to be successful in eliminating the metal stiffener lifted issue in manufacturing of flexible printed circuit board. As a result, there are no records of customer complaint on metal stiffener lifted issue since the selection is implemented and production yield automatically increased and maintain at high range.