Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application

• Auteur principal: Jamaluddin, Nurezzaty
• Format: Thèse
• Langue: anglais; anglais
• Publié: 2020
• Sujets: T Technology (General); TJ Mechanical engineering and machinery
• Accès en ligne: http://eprints.utem.edu.my/id/eprint/25572/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199

This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if backside chipping increases, sidewall chipping will increases as well. In order to reduce backside chipping, investigation had found three potential area that may improve backside and sidewall chipping with parameter optimization. Two main element was identified on this problem which are material and machine. Z2 blade type is identify as one of contribution of this issue and machine parameter for chuck table feedspeed and cutting ratio are the other variance that causing higher backside chipping. By using six sigma tools (DMAIC) this project resulted improve yield performance with new type ofZ2 blade with optimize parameter of table feedspeed and cutting depth ratio.