Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application

This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if...

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Bibliographic Details
Main Author:	Jamaluddin, Nurezzaty
Format:	Thesis
Language:	English English
Published:	2020
Subjects:	T Technology (General) TJ Mechanical engineering and machinery
Online Access:	http://eprints.utem.edu.my/id/eprint/25572/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199
Abstract	Abstract here

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