Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process
Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon...
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية الإنجليزية |
| منشور في: |
2020
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/25573/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119122 |
| Abstract | Abstract here |