Experimental Investigation Of Mechanical Dicing Parameters On The Quality Of Thin Glass Wafer Cutting Process

Silicon-glass device has been adopted in the industry especially used on applications like pressure sensor, accelerometer, microfluidic device, micropump, microturbine, and micro-actuator. In this study, the focus of the package application is current sensors with component of an ultra-thin silicon...

पूर्ण विवरण

ग्रंथसूची विवरण
मुख्य लेखक: Liou, Jacqueline Jing Wen
स्वरूप: थीसिस
भाषा:अंग्रेज़ी
अंग्रेज़ी
प्रकाशित: 2020
विषय:
ऑनलाइन पहुंच:http://eprints.utem.edu.my/id/eprint/25573/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119122
Abstract Abstract here

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