Interfacial adhesion between silver ink and thermoplastic polyurethane and electromechanical reliability of flexible printed circuit
Flexible printed circuit (FPC) is one of the promising components in the electronic industries. The advantages of FPC are that its fabrication process is environmentally friendly, low cost, and efficient, which makes it a favourable choice for applications in industrial and medical. The conductive i...
| المؤلف الرئيسي: | Mohd Yunos, Afiqah |
|---|---|
| التنسيق: | أطروحة |
| اللغة: | الإنجليزية الإنجليزية |
| منشور في: |
2021
|
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.utem.edu.my/id/eprint/25974/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121047 |
| Abstract | Abstract here |
مواد مشابهة
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مواد مشابهة
-
Effect of low temperature on the performance of carbo -based conductive ink for flexible printed circuit
حسب: Buyamin, Norsheila
منشور في: (2019) -
Elimination Of Metal Stiffener Lifted Issue In Flexible Printed Circuit Board
حسب: Safri, Syarnila
منشور في: (2020) -
Characterization of thermoplastic polyurethane elastomer coated pineapple leaf fiber
حسب: Dhiya Shabana Abdullah
منشور في: (2025) -
Development of sugar palm fibre reinforced thermoplastic polyurethane composites
حسب: Abbas, Mohammed Ausama Al-Sarraf
منشور في: (2017) -
Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
حسب: Lim, Chong Hooi
منشور في: (2017)
