Corrosion of palladium coated copper wire bonds under high temperature storage reliability test
Palladium coated copper (PCC) wire is emerging as an alternative to bare copper (Cu) wire in the semiconductor industry due to better manufacturing yield and reliability stress performance. However, the acceptance of PCC wire for automotive device is still low due to the stringent reliability requir...
| Main Author: | Cha, Chan Lam |
|---|---|
| Format: | Thesis |
| Language: | English English |
| Published: |
2021
|
| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/25978/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121056 |
| Abstract | Abstract here |
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