Surfaces (Technology) Surface preparation Coating processes Tungsten carbide-cobalt alloys

Within electronics industry, flexible printed circuits (FPC) are compiled in stacks to achieve smaller sizes and higher component density. The architecture size of a computer processor has been shrunk from 10 µm to 7 nm from year 1971 to 2020. In order to meet the market expectation, manufacturers h...

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Bibliographic Details
Main Author:	Wong, Kah Yan
Format:	Thesis
Language:	English English
Published:	2021
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/26053/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121228
Abstract	Abstract here

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