APA (7th ed.) Citation

Nandagopal, V. A. (2021). Fluid dynamic simulation for diffusion solder die bond.

Chicago Style (17th ed.) Citation

Nandagopal, Vanisha Ashweeni. Fluid Dynamic Simulation for Diffusion Solder Die Bond. 2021.

MLA (9th ed.) Citation

Nandagopal, Vanisha Ashweeni. Fluid Dynamic Simulation for Diffusion Solder Die Bond. 2021.

Warning: These citations may not always be 100% accurate.