Fluid dynamic simulation for diffusion solder die bond

This thesis investigates the computational fluid dynamics simulation of NiSn diffusion solder die bond process simulation methodology. As semiconductor industry is moving towards manufacturing complex and cost saving packages, more material and process methodology is being explored. The current appr...

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Bibliographic Details
Main Author:	Nandagopal, Vanisha Ashweeni
Format:	Thesis
Language:	English English
Published:	2021
Subjects:	T Technology (General) TA Engineering (General). Civil engineering (General)
Online Access:	http://eprints.utem.edu.my/id/eprint/26853/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=121725
Abstract	Abstract here

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