APA (7th ed.) Citation

Ahmad, I. F. (2022). The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging.

Chicago Style (17th ed.) Citation

Ahmad, Intan Fatihah. The Analysis on Functionality of Composite Solder Oxidize Copper Lead Frame Interconnect in Microelectronic Packaging. 2022.

MLA (9th ed.) Citation

Ahmad, Intan Fatihah. The Analysis on Functionality of Composite Solder Oxidize Copper Lead Frame Interconnect in Microelectronic Packaging. 2022.

Warning: These citations may not always be 100% accurate.