The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging
Recently, the attention toward CNT-composite solder (CCS) has increased remarkably due to numerous advantages. However, the electronic devices’ failure is still growing and has become an integral part of the countless product in the industrial market. These failures are mainly related to the reliabi...
| 第一著者: | |
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| フォーマット: | 学位論文 |
| 言語: | 英語 英語 |
| 出版事項: |
2022
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| 主題: | |
| オンライン･アクセス: | http://eprints.utem.edu.my/id/eprint/26873/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122194 |
| Abstract | Abstract here |