A crystallographic optimization study in Ta TaN bi-layer sputtering to reduce semiconductor manufacturing queue time constraint

The Physical Vapor Deposition (PVD) magnetron sputtering method is the most extensively used technique for depositing metallic thin film in the semiconductor wafer fabrication industry. The PVD equipment manufacturer has specified stringent control, in this case, a queue time restriction between the...

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Bibliographic Details
Main Author:	Ahmad, Anuar Fadzil
Format:	Thesis
Language:	English English
Published:	2022
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/26909/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122055
Abstract	Abstract here

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