Microstructural characterization of pressureless sintered silver die attached material

Sintered silver (Ag) is one of the most promising interconnect materials for high power electronics applications due to its ability to withstand high temperature exceeding 250 °C while in operation.In this thesis, themicrostructural evolutions of spherical and flake types pressureless sintered Ag di...

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Bibliographic Details
Main Author:	Esa, Siti Rahmah
Format:	Thesis
Language:	English English
Published:	2022
Subjects:	T Technology (General) TN Mining engineering. Metallurgy
Online Access:	http://eprints.utem.edu.my/id/eprint/26950/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122148
Abstract	Abstract here

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